01 / DEVELOPER SUMMIT
Start with the industry panorama
Addresses from government and industry, a strategic partnership signing, keynote sessions and an advanced-packaging market outlook.
ADVANCED PACKAGING
DEVELOPER CONFERENCE
Advanced Packaging
Developer Conference
A technical exchange and collaborative innovation platform for advanced packaging developers and the global ecosystem—connecting chips, systems and applications around frontier technology and real engineering challenges.
DATE & TIME03 DEC 202610:00 – 17:00
VENUEHong Kong Science ParkHong Kong
APDC 2026 · HONG KONG
One day to connect
ideas, technology and action.
See the industry’s direction in the morning; enter real engineering discussions in the afternoon. Meet developers, technical experts, industry leaders and innovators in Hong Kong.
AGENDA / MAIN STAGE
02 / NETWORKING LUNCH
Lunch and industry connections
Meet developers, partners and peers in an open setting.
03 / PARALLEL FORUMS
10+ sessions · 30+ discussion topics
Move from technology trends to engineering practice through focused sharing, cases and cross-disciplinary discussion.
04 / OPEN CONNECTION
Conversations that lead to the next collaboration
Programme subject to final announcement.
PARALLEL FORUMS
Six focus areas (proposed)
AI & HPC Packaging
High-bandwidth, high-density and energy-efficient integration.
Robotics & Automotive
High reliability, performance and complex environments.
Silicon Photonics & CPO
Optoelectronic convergence and next-generation interconnect.
Glass Substrate & PLP
New paths for large-format, high-density packaging.
Advanced Bonding & TSV
Core processes for 2.5D/3D and heterogeneous integration.
Co-design & Reliability
From design collaboration to scaled deployment.
ABOUT APDC · JOURNEY
From technical breakthrough
to industry co-creation.
Advanced packaging is becoming the critical link between chips, systems and applications.
From 2.5D/3D integration and chiplets to optical interconnect, new materials and high-density systems, APDC puts developers at the centre—connecting technology, applications and the ecosystem so frontier research reaches engineering practice and scale.
WHERE ADVANCED PACKAGINGDEVELOPERS CONNECTAND CREATE.
Developers
Connecting design, process, materials, equipment, packaging, test and systems developers.
Real applications
Addressing fast-moving needs across AI, HPC, automotive, robotics and communications.
Open ecosystem
Enabling technical exchange and collaboration across the value chain.
THE JOURNEY / 2024—2026
From China, to Singapore, and now Hong Kong.
Expanding technical horizons and industrial connections.
2024 · START
Shanghai · Zhangjiang
APDC’s first edition established a specialist technical platform for developers.
600+attendees
2025 · CONNECT
Singapore · Sentosa
APDC went international and broadened global industry exchange.
700+attendees
2026 · EXPAND
Shanghai · Auto & Robotics
From technology to applications, exploring new paths in system integration.
400+attendeesWHY HONG KONG
Connect Asia.
Connect the world.
Hong Kong connects Mainland China and global markets as a key hub for international technology, finance and industry. Here, APDC grows its worldwide developer network and turns technical exchange into industry connection.
China and the world
Enabling technology exchange and collaboration across regions and value chains.
Global innovation, together
From chip design to system applications, the global value chain converges here.
From exchange to collaboration
Where developers, technology partners and industry pioneers meet and create.
APDC 2026 · HONG KONG
3 December.
See you at HKSTP.
Connect developers · Share technology · Create together
Register →